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- Title
Effect of an Alkoxyliertes Beta Naphthol on Cu Electrodeposition for Application to Low‐Resistivity Cu Interconnects.
- Authors
Suh, Hoyoung; Heo, Mina; Lee, Ji‐Hyun; Kim, Jin‐Gyu; Hong, Kimin
- Abstract
Cu thin films were electrodeposited using electrolytes containing alkoxyliertes beta naphthol (ABN) as an organic additive, which shows a strong suppressing effect similar to PEG10000. The surface roughness of Cu thin film decreased, while the grain size remained unchanged with increasing ABN concentration. Consequently, the resistivity of Cu thin film was reduced by 41% compared to Cu thin film electrodeposited using pure electrolyte. In addition, the void free interconnect wire was fabricated by filling of 70‐nm wide trench using only ABN, without the help of any accelerator or leveler.
- Subjects
NAPHTHOL; COPPER films; THIN films; SURFACE roughness; GRAIN size; ADDITIVES; ALLOY plating; ELECTROPLATING
- Publication
Bulletin of the Korean Chemical Society, 2020, Vol 41, Issue 5, p530
- ISSN
0253-2964
- Publication type
Article
- DOI
10.1002/bkcs.12003