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- Title
Thermoelectric Performance of Non-Stoichiometric Permingeatite Cu 3+m SbSe 4.
- Authors
Kim, DanAh; Kim, Il-Ho
- Abstract
Non-stoichiometric permingeatites Cu3+mSbSe4 (−0.04 ≤ m ≤ −0.02) were synthesized, and their thermoelectric properties were examined depending on the Cu deficiency. Phase analysis by X-ray diffraction revealed no detection of secondary phases. Due to Cu deficiency, the lattice parameters of tetragonal permingeatite decreased compared to the stoichiometric permingeatite, resulting in a = 0.5654–0.5654 nm and c = 1.1253–1.1254 nm, with a decrease in the c/a ratio in the range of 1.9901–1.9903. Electrical conductivity exhibited typical semiconductor behavior of increasing conductivity with temperature, and above 423 K, the electrical conductivity of all samples exceeded that of stoichiometric permingeatite; Cu2.96SbSe4 exhibited a maximum of 9.8 × 103 Sm−1 at 623 K. The Seebeck coefficient decreased due to Cu deficiency, showing p-type semiconductor behavior similar to stoichiometric permingeatite, with majority carriers being holes. Thermal conductivity showed negative temperature dependence, and both electronic and lattice thermal conductivities increased due to Cu deficiency. Despite the decrease in the Seebeck coefficient due to Cu deficiency, the electrical conductivity increased, resulting in an increase in the power factor (especially a great increase at high temperatures), with Cu2.97SbSe4 exhibiting the highest value of 0.72 mWm−1K−2 at 573 K. As the carrier concentration increased due to Cu deficiency, the thermal conductivity increased, but the increase in power factor was significant, with Cu2.98SbSe4 recording a maximum dimensionless figure-of-merit of 0.50 at 523 K. This value was approximately 28% higher than that (0.39) of stoichiometric Cu3SbSe4.
- Subjects
SEEBECK coefficient; THERMAL conductivity; COPPER; THERMOELECTRIC materials; CARRIER density; ELECTRIC conductivity
- Publication
Materials (1996-1944), 2024, Vol 17, Issue 17, p4345
- ISSN
1996-1944
- Publication type
Article
- DOI
10.3390/ma17174345