We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder.
- Authors
Liu, Yang; Ren, Boqiao; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Chen, Penghui; Zeng, Xianghua
- Abstract
In this study, porous metals (Ni, Cu) with the porosity of 110 and 500 ppi were, respectively, added into the SnBi solder joint to obtain the SnBi@P–Cu and SnBi@P–Ni composite solder joints. To ensure the bonding quality between the solder layers and the Cu substrates, a low pressure of 0.1 MPa was conducted during the soldering process. The microstructure and shear behavior of the composite solder joints were investigated. With the addition of 110 ppi porous metals, the microstructures of the solder joints are mainly composed of porous metals and SnBi solder matrix. As the porosity of P–Cu and P–Ni metals increases to 500 ppi, the concentration of the SnBi matrix decreases sharply in the solder joints. The cross-sectional microstructures of the solder joints present a uniform morphology of P-metals and intermetallic compound (IMC). Here the IMC is Cu6Sn5 in the SnBi@P–Cu joint, but (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 in the SnBi@P–Ni joint. The shear strength of the SnBi solder joint increases significantly with the addition of porous metals. The average shear strength of SnBi@110P–Cu reaches 85.28 MPa, which is the highest among the investigated solder joints.
- Subjects
SOLDER joints; SOLDER &; soldering; INTERMETALLIC compounds; COPPER-tin alloys; COPPER; SHEAR strength; METALLIC composites; POROUS metals
- Publication
Journal of Materials Science: Materials in Electronics, 2021, Vol 32, Issue 14, p18968
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-021-06412-5