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- Title
PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.
- Authors
Madala, Surendra
- Abstract
The article discusses the application of plasma focused ion beam (PFIB) technology which provides larger-scale integrated circuit structures a delayering or deprocessing and site-specific failure analysis capabilities. Topics discussed include the technology's ability to modify packaging circuits, the development of an open through-silicon vias (TSV) interconnect technology, and the interconnects quality in microelectronic packaging.
- Subjects
FOCUSED ion beams; FAILURE analysis; INTEGRATED circuit packaging; THROUGH-silicon via; INTEGRATED circuit interconnections; LARGE scale integration of circuits; MICROELECTRONIC packaging
- Publication
Electronic Device Failure Analysis, 2016, Vol 18, Issue 1, p30
- ISSN
1537-0755
- Publication type
Article
- DOI
10.31399/asm.edfa.2016-1.p030