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- Title
Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy.
- Authors
Hu Hao; Yaowu Shi; Zhidong Xia; Yongping Lei; Fu Guo
- Abstract
Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 °C to 150 °C. The compressive stress induced by the lattice expansion of the oxidized ErSn3 phase provides the driving force and the tin atoms released from the oxidization of the ErSn3 phase provide the material source for the tin whisker growth.
- Subjects
METALLIC whiskers; TIN alloys; MORPHOLOGY; LATTICE theory; ATOMS; LATTICE dynamics; OXIDATION
- Publication
Metallurgical & Materials Transactions. Part A, 2009, Vol 40, Issue 8, p2016
- ISSN
1073-5623
- Publication type
Article
- DOI
10.1007/s11661-009-9871-8