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- Title
Conductive Polyaniline for Potential Application in Anisotropic Conductive Films.
- Authors
Ha, Yong-Seok; Park, Hong-Gyu; Seo, Dae-Shik
- Abstract
Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.
- Subjects
POLYANILINES; FLEXIBLE printed circuits; CONDUCTING polymers; CONTACT resistance (Materials science); ANISOTROPIC conductive films; BOND formation mechanism
- Publication
Journal of Electronic Materials, 2015, Vol 44, Issue 4, p1200
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-014-3612-5