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- Title
Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management.
- Authors
Zhang, Peijuan; Hao, Yuanyuan; Shi, Hang; Lu, Jiahao; Liu, Yingjun; Ming, Xin; Wang, Ya; Fang, Wenzhang; Xia, Yuxing; Chen, Yance; Li, Peng; Wang, Ziqiu; Su, Qingyun; Lv, Weidong; Zhou, Ji; Zhang, Ying; Lai, Haiwen; Gao, Weiwei; Xu, Zhen; Gao, Chao
- Abstract
Highlights: Presenting the first investigation into the structurally bubbling-failure mechanism of graphitic film during cyclic liquid nitrogen shocks. Proposing an innovative design about seamless heterointerface constructing a Cu-modified structure. Inventing a new ultra-stable species of highly thermally conductive films to inspire new techniques for efficient and extreme thermal management. Highly thermally conductive graphitic film (GF) materials have become a competitive solution for the thermal management of high-power electronic devices. However, their catastrophic structural failure under extreme alternating thermal/cold shock poses a significant challenge to reliability and safety. Here, we present the first investigation into the structural failure mechanism of GF during cyclic liquid nitrogen shocks (LNS), which reveals a bubbling process characterized by "permeation-diffusion-deformation" phenomenon. To overcome this long-standing structural weakness, a novel metal-nanoarmor strategy is proposed to construct a Cu-modified graphitic film (GF@Cu) with seamless heterointerface. This well-designed interface ensures superior structural stability for GF@Cu after hundreds of LNS cycles from 77 to 300 K. Moreover, GF@Cu maintains high thermal conductivity up to 1088 W m−1 K−1 with degradation of less than 5% even after 150 LNS cycles, superior to that of pure GF (50% degradation). Our work not only offers an opportunity to improve the robustness of graphitic films by the rational structural design but also facilitates the applications of thermally conductive carbon-based materials for future extreme thermal management in complex aerospace electronics.
- Subjects
HETEROJUNCTIONS; CARBON-based materials; STRUCTURAL stability; LIQUID nitrogen; ELECTRONIC equipment; STRUCTURAL failures
- Publication
Nano-Micro Letters, 2023, Vol 16, Issue 1, p1
- ISSN
2311-6706
- Publication type
Article
- DOI
10.1007/s40820-023-01277-1