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- Title
Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding.
- Authors
Shao, Huakai; Wu, Aiping; Bao, Yudian; Zhao, Yue; Zou, Guisheng
- Abstract
Low temperature transient liquid phase (LTTLP) bonding is a promising technology to enable in high temperature electronic packaging. In this study, interfacial reaction and mechanical characterizations for Cu/Sn/Ag system LTTLP bonding at temperatures ranging from 260 to 340 °C for various time were investigated. Experimental results showed that Cu and Ag substrate independently reacted with molten Sn, and the growth of IMCs on one side was hindered by the opposite IMCs layer after scalloped CuSn contacted with the AgSn, and there was no ternary alloy phase formed all the time. Pores were found and distributed at the CuSn/AgSn interface or between grain boundaries after the residual Sn was fully consumed, however, they gradually disappeared with continuing reaction of that CuSn phase converted into CuSn phase. Shear strength of the LTTLP joints increased with increasing bonding time, and the adhesive strength of CuSn/AgSn interface was weaker than that of the CuSn/AgSn interface. The rupture behaviors were also discussed with a fracture model. As follow, cracks initiated in the pore and mainly propagated along the CuSn/AgSn interface for the joint consisted of layered CuSn, CuSn and AgSn IMCs, however, failure path only passed through the CuSn layer after CuSn islands were completely transformed.
- Subjects
INTERFACIAL reactions; COPPER-tin alloys; INTERMETALLIC compounds; CHEMICAL bonds; SHEAR strength
- Publication
Journal of Materials Science: Materials in Electronics, 2016, Vol 27, Issue 5, p4839
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-016-4366-z