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- Title
Shielding evaluation of on-package conformal shields by numerical modelling and experimental measurement.
- Authors
Park, H. H.; Seo, K.; Kwon, Y.-K.; Park, H.-B.
- Abstract
A reliable numerical modelling for shielding evaluation of on-package conformal shields based on the integrated circuit (IC)-stripline method is presented. As a pilot test, the effects of the number of grounding pads and the thickness of a conformal shield on the shielding performance are investigated. For validation, the conformal shield is fabricated and measured by both the IC-stripline method and TEM cell method.
- Subjects
INTEGRATED circuits; ELECTROMAGNETIC shielding; ELECTROMAGNETIC interference; CIRCUIT resonance; COMPUTER simulation; MATHEMATICAL models
- Publication
Electronics Letters (Wiley-Blackwell), 2017, Vol 53, Issue 14, p916
- ISSN
0013-5194
- Publication type
Article
- DOI
10.1049/el.2017.0524