Found: 18
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Application of deep eutectic solvents in the extraction and separation of target compounds from various samples.
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- Journal of Separation Science, 2015, v. 38, n. 6, p. 1053, doi. 10.1002/jssc.201401347
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- Article
Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates.
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- Journal of Electronic Materials, 2017, v. 46, n. 4, p. 2323, doi. 10.1007/s11664-016-5272-0
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- Article
Al-Ge Diffusion Bonding for Hermetic Sealing Application.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y
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- Article
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging.
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- Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2889, doi. 10.18494/SAM.2018.1948
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- Article
Effect of Lamellar Spacing on Creep Strength of α-Mg/C14Mg<sub>2</sub>Ca Eutectic Alloy.
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- Materials Transactions, 2021, v. 62, n. 9, p. 1414, doi. 10.2320/matertrans.MT-M2021101
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- Article
Characteristics of Eutectic α(Cr,Fe)-(Cr,Fe)C in the Eutectic Fe-Cr-C Hardfacing Alloy.
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- Metallurgical & Materials Transactions. Part A, 2017, v. 48, n. 1, p. 493, doi. 10.1007/s11661-016-3828-5
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- Article
Influence of Processing Parameters on the Solidification Behavior of Single-Crystal CMSX-4 Superalloy.
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- Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 7, p. 3703, doi. 10.1007/s11661-016-3542-3
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- Article
The pH Behavior of Seventeen Deep Eutectic Solvents.
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- BioResources, 2018, v. 13, n. 3, p. 5042, doi. 10.15376/biores.13.3.5042-5051
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- Article
Microstructure evolution and shear behavior of Au-Sn/Ni- xCo ( x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 10, p. 7286, doi. 10.1007/s10854-017-6413-9
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- Article
Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3427, doi. 10.1007/s10854-015-2852-3
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- Article
Modelo de equilibrio químico para representar solubilidades de sistemas ternarios y su aplicación a la predicción de eutécticos de sistemas cuaternarios.
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- INGENIARE - Revista Chilena de Ingeniería, 2020, v. 28, n. 1, p. 31
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- Article
Investigation of Au/Si EutecticWafer Bonding for MEMS Accelerometers.
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- Micromachines, 2017, v. 8, n. 5, p. 158, doi. 10.3390/mi8050158
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- Article
Microstructural Characterization of Melt Extracted High-Nb-Containing TiAl-Based Fiber.
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- Materials (1996-1944), 2017, v. 10, n. 2, p. 195, doi. 10.3390/ma10020195
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- Article
Kinetics of triple-junctions in eutectic solidification: a sharp interface model.
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- Journal of Materials Science, 2015, v. 50, n. 1, p. 176, doi. 10.1007/s10853-014-8577-5
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- Article
Modeling of free eutectic growth and competitive solidification in undercooled near-eutectic alloys based on in situ measurements.
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- Journal of Materials Science, 2015, v. 50, n. 1, p. 268, doi. 10.1007/s10853-014-8585-5
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- Article
Effect of structural transition in an amorphous NiP alloy on the wetting by a eutectic Sn-Bi solder.
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- Journal of Materials Science, 2014, v. 49, n. 7, p. 2932, doi. 10.1007/s10853-013-8004-3
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- Article
Low temperature TLP bonding of AlO-ceramics using eutectic Au-(Ge, Si) alloys.
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- Journal of Materials Science, 2013, v. 48, n. 20, p. 7115, doi. 10.1007/s10853-013-7526-z
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- Article
Effects of natural deep eutectic solvents on lactic acid bacteria viability during cryopreservation.
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- Applied Microbiology & Biotechnology, 2018, v. 102, n. 13, p. 5695, doi. 10.1007/s00253-018-8996-3
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- Article