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- Title
Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes.
- Authors
Lee, Tae-Young; Kim, Jungsoo; Jun, So-Yeon; Ahn, Byeong-Jin; Han, Deok-Gon; Yoo, Sehoon
- Abstract
The interfacial microstructure and brittle fracture reliability of solder joints on direct electroless gold (DEG) and electroless palladium immersion gold (EPIG), which are novel surface finishes for high-frequency package substrates, were evaluated in this study. A Cu6Sn5 intermetallic compound (IMC) was formed at the interface of Sn-3.0Ag-0.5Cu (SAC305)/DEG or SAC305/EPIG, while (Cu,Ni)6Sn5 and Ni3P were formed at the interface of SAC305/ENEPIG. After 1000 h of thermal aging, the IMC thickness of the SAC305/DEG and SAC305/EPIG samples increased by 217% and by 181%, respectively, while that of SAC305/ENEPIG increased by only 51%. Although ENEPIG had the lowest IMC thickness, its brittleness was higher than that of DEG and EPIG because of the different fracture paths. Fractures occurred between Cu6Sn5/Cu pad and Cu6Sn5/Cu3Sn interface for SAC305/DEG and SAC305/EPIG, while fractures mainly occurred in the Ni3P layer of SAC305/ENEPIG.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 2, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-022-09510-0