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- Title
Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages.
- Authors
Hao Zhang; Ang, Simon S.
- Abstract
With the emergence of new power semiconductor devices and packaging technologies, the power density of the power packages or modules is increasing rapidly. Double-sided cooling power packages maximize heat dissipation by enabling heat removal from both the top and bottom sides of the module. This article compares single-sided and double-sided cooling power packaging structures to elucidate advantages and disadvantages of these packaging structures in terms of thermal and thermomechanical based on finite element simulations. Simulation results reveal that double-sided cooling power packages greatly improve their thermal performances, but they face challenges due to their high thermo-mechanical stresses. The use of a viscoelastic underfill resin and a coefficient of thermal expansion matched ceramic chip carrier in the double-sided cooling power packaging structure is shown to reduce thermo-mechanical stresses.
- Subjects
SEMICONDUCTOR devices; THERMAL properties of semiconductors; THERMOMECHANICAL treatment; COOLING; ELECTRONIC packaging; ENERGY dissipation; POWER density
- Publication
Journal of Microelectronic & Electronic Packaging, 2016, Vol 13, Issue 1, p23
- ISSN
1551-4897
- Publication type
Article
- DOI
10.4071/imaps.495