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- Title
Unraveling the contribution of copper seed priming in enhancing chromium tolerance in wheat by improving germination, growth, and grain yield.
- Authors
Hafeez, Khadija; Atif, Muhammad; Perveen, Shagufta; Parveen, Abida; Akhtar, Faiza; Yasmeen, Nadia
- Abstract
Exposure to chromium (Cr) on farmlands drastically restricts the growth and productivity of cereal crops, including wheat (Triticum aestivum L.). Utilizing micronutrients, the seed-priming strategy is crucial to preventing the adverse consequences of Cr-stress. Nevertheless, additional investigation needs to be conducted to figure out whether Cu-priming remedies are beneficial for wheat experiencing Cr-stress. The objective of this study was to ascertain the contribution of Cu-treated seed priming in the mitigation of detrimental impacts of Cr-stress on wheat germination, growth, and production. Two wheat cultivars, Dilkash-20 and Subhani-21, were subjected to seed priming treatments (0 mg/L, 0.1 mg/L, and 1.0 mg/L) of Cu under Cr-stress levels (200 mg/kg) in two successive experiments, respectively, petri-dish and soil-filled pot experiments. The Cu-priming significantly enhanced the wheat seed germination, plant growth, and grain yield under Cr-stress. Cu priming improved enzyme activities such as glutathione peroxidase (14.60, 16.30%), superoxide dismutase (62.55, 115.21%), peroxidase, catalase (78.39, 80.23%), ascorbate peroxidase(17.72, 20.32%), and key primary and secondary metabolites such as proline (54.19, 81.27%), glycine betaine (40.13, 79.39%), total soluble proteins (47.92, 51.58%), phenolics (40.05, 18.61%), and flavonoids (56.90, 113.46%), respectively, of Dilkash-20 and Subhani-21 under Cr-stress. The outcome of our investigation underscored the efficacy of Cu-priming treatments (0.1 mg/L and 1.0 mg/L) in Cr-stress circumstances to augment wheat germination, growth, and grain yield.
- Subjects
GRAIN yields; WHEAT seeds; COPPER; GERMINATION; BETAINE; CHROMIUM; SEED treatment; WHEAT
- Publication
Environmental Science & Pollution Research, 2024, Vol 31, Issue 27, p39549
- ISSN
0944-1344
- Publication type
Article
- DOI
10.1007/s11356-024-33848-z