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- Title
Effect of Carbon Nanotube on Microstructure and Hardness of Sn96.5Ag3.0Cu0.5 Solder for Microelectronic Packaging.
- Authors
Fatihah, I. A.; Omar, G.; Hamid, H. A.; Salim, M. A.
- Abstract
This study investigated the SAC305 solder alloy's performance after being reinforced with 0.01, 0.02, 0.03, and 0.04 wt.% of CNT. The performance of reinforced solders was evaluated based on their microstructure and hardness. The reinforced solder's microstructure was observed using Scanning Electron Microscope (SEM) equipped with Energy Dispersive X-ray (EDX). The indentation of reinforced solder was carried out to identify its mechanical properties. According to the P-h graph, the reinforced solder becomes harder as the wt.% of CNT incorporated into the solder increases. The CNT particles were observed to be distributed along the grain boundary and suppressed the solder's crystal nucleation through the pinning effect process. Compared to SAC 305 solder alloy, the reinforced solder has better performance in terms of mechanical properties.
- Subjects
CARBON nanotubes; MICROELECTRONIC packaging; SOLDER &; soldering; SCANNING electron microscopes; HARDNESS; PACKAGING materials
- Publication
International Review of Mechanical Engineering, 2021, Vol 15, Issue 7, p346
- ISSN
1970-8734
- Publication type
Article
- DOI
10.15866/ireme.v15i7.20148