We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
NANOMECHANICAL PROPERTIES OF A Sn-Ag-Cu SOLDER REINFORCED WITH Ni-COATED CARBON NANOTUBES.
- Authors
HAN, Y. D.; JING, H. Y.; NAI, S. M. L.; XU, L. Y.; TAN, C. M.; WEI, J.
- Abstract
In the present study, 0.05 wt.% of Ni-coated multi-walled carbon nanotubes (Ni-CNTs) were successfully incorporated into the 95.8Sn-3.5Ag-0.7Cu solder using the powder metallurgy technique, to synthesize a new lead-free composite solder. Its mechanical property (in terms of hardness) was investigated at room temperature using the nanoindentation method. The results revealed that the nanoindentation hardness increased by 14.3% with the incorporation of 0.05 wt.% of Ni-coated CNTs. This observation is in good agreement with the microhardness test results. Moreover, the addition of Ni-CNTs improved the creep resistance of the composite solder. The test results established that nanotechnology coupled with composite technology in electronics solders can result in the enhancement of mechanical properties. These advanced interconnect materials will thus benefit the microelectronics assembly and packaging industry.
- Subjects
CARBON nanotubes; SOLDER &; soldering; NANOTECHNOLOGY; MICROELECTRONICS; PACKAGING industry; MICROSTRUCTURE; MICROHARDNESS
- Publication
International Journal of Nanoscience, 2010, Vol 9, Issue 4, p283
- ISSN
0219-581X
- Publication type
Article
- DOI
10.1142/S0219581X10006818