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- Title
The Effects of Core–Shell-Structured SiO<sub>2</sub>@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.
- Authors
Jiang, H.; Zhou, M. B.; Zhang, X. P.
- Abstract
In this study, sub-microscale spherical particles composed of SiO2 cores encapsulated by silver layers (i.e., SiO2@Ag) were synthesized and incorporated in microscale Ag-flake-filled electrically conductive adhesive (ECA). SiO2 spheres with an average diameter of 400 nm were fabricated by the modified Stöber process and then coated with a thin silver layer as a shell with a thickness of about 50 nm through electroless plating. The mechanical and electrical properties and the microstructural characteristics of the ECA filled with different ratios of SiO2@Ag spheres to Ag flakes were studied. The influence of mixed fillers with different constituents on the electrical properties of the ECA was also investigated by finite element simulation. The results show that replacing a small quantity of Ag flakes with the same mass fraction of SiO2@Ag spheres can significantly improve the electrical and mechanical properties of the ECA. The addition of SiO2@Ag spheres results in a combined effect of decreasing the space between Ag flakes and enhancing their nondirectional arrangement, leading to the formation of more conductive paths. The most obvious improvement in electrical and mechanical properties was found for ECA containing 65 wt.% conductive fillers with a weight ratio of 2:48 between SiO2@Ag spheres and Ag flakes. The simulation results show good consistency with experimental studies and demonstrate the superior enhancement effect of SiO2@Ag spheres on the overall performance of the ECA.
- Subjects
ELECTROLESS plating; ADHESIVES; COATING processes; ELECTRONIC packaging; SPHERES
- Publication
Journal of Electronic Materials, 2024, Vol 53, Issue 3, p1272
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-023-10864-2