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- Title
The Role of Bi<sup>3+</sup> - complex lon as the Stabilizer in Electroless Nickel Plating Process.
- Authors
Wang, K.; Hong, L.; Liu, Z.-L.
- Abstract
The article presents a discussion of the usage of Bi3+-complex ion as a substitute for the more toxic Pb2+ ion as a stabilizer in electroless nickel plating (ENP) processes. The asymmetric derivatives of ethylenediaminetetraacetic acid (EDTA) are found to be a form of coordination ligand. The combination of the asymmetric derivatives of EDTA with Bi3+ ions to create soluble complexes within the acidic ENP solution is noted, mentioning that the Bi3+-complex ion exhibits a critical stabilizer concentration of around 10-5 moles per liter (mol/L) in the ENP system examined here.
- Subjects
ELECTROLESS plating; BISMUTH; IONS; COMPLEX ions; LEAD; ETHYLENEDIAMINETETRAACETIC acid
- Publication
AIChE Journal, 2009, Vol 55, Issue 4, p1046
- ISSN
0001-1541
- Publication type
Article
- DOI
10.1002/aic.11807