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- Title
Effect of temperature on mechanism and kinetics of electrochemical nucleation of copper in ChCl-based deep eutectic solvents.
- Authors
Fu, Xu; Zhan, Chongbo; Zhang, Runjia; Wang, Baojie; Sun, Haijing; Sun, Jie
- Abstract
The electrochemical reduction behaviors of copper ions were investigated by using cyclic voltammetry method and chronoamperometry method in choline chloride–ethylene glycol (ChCl–EG) deep eutectic solvents, and the effect of electrodeposition system temperature on copper nucleation kinetics and electrodeposition process was analyzed. The phase analysis and micro-morphological analysis of the obtained copper coating were carried out by means of X-ray diffraction and scanning electron microscopy. The results showed that, in the electrodeposition system with ChCl–EG as the base solution, the equilibrium potential shifted to a more positive direction with the increase of the system temperature, and the nucleation overpotential required for copper to start nucleation on the glassy carbon electrode surface decreased sharply. The test results obtained using chronoamperometry showed that the electrodeposition of copper involved multiple processes, including the nucleation of copper ions, and the reduction of trace water on the electrode surface. The contribution of the nucleation process can be enhanced by increasing the temperature. The increase of temperature can promote the preferential growth of Cu (111) crystal plane and can get a denser coating.
- Subjects
EUTECTICS; NUCLEATION; TEMPERATURE effect; CARBON electrodes; COPPER; ELECTROLYTIC reduction
- Publication
Journal of Solid State Electrochemistry, 2022, Vol 26, Issue 12, p2713
- ISSN
1432-8488
- Publication type
Article
- DOI
10.1007/s10008-022-05282-z