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- Title
Effect of Organic/Inorganic Coating on Moisture Diffusion in a Chip-on-Board Package with Globtop.
- Authors
Weidong Huang; Xuhong Wang, G.; Li Wang; Mei Sheng, G.; Liqiang Xu, G.; Stubhan, Frank; Le Luo, Frank
- Abstract
The moisture diffusion in globtop material for a chip-on-board (COB) package coated with SiN[subx] and silicone, respectively, or coated with SiN[subx] plus silicone were measured by embedding a humidity sensor in the globtop and recording the capacitive change in three different temperature/humidity environments. The experimental results were simulated by Fick's diffusion law with finiteelement method modeling. The moisture diffusion coefficients and activation energies were calculated to quantitatively compare the moisture-resistance effects of different coatings. For example, at 85°C/85% RH, the moisture diffusion coefficients for the uncoated reference, SiN[subx]-coated, silicone-coated, and silicone/SiN[subx] double-layered coated samples are 1E-5, 0.8E-5, 0.7E-5, and 0.2E-5 mm²/s, respectively. The experimental and simulation results show that double-layered coating with silicone/SiN[subx] has excellent moisture-resistance properties because it not only smoothes the steps on a printed circuit board (PCB) but also keeps the good moisture resistance of the inorganic films.
- Subjects
DIFFUSION; SILICON; HUMIDITY; FINITE element method; NUMERICAL analysis; SURFACES (Technology)
- Publication
Journal of Electronic Materials, 2004, Vol 33, Issue 2, p101
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-004-0277-5