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- Title
Novel cocklebur-like nano silver oxide for low-temperature curing pastes with dense conductive paths.
- Authors
Li, Chunmei; Sun, Ying; Sun, Miao; Lin, Baoping; Zhang, Xueqin
- Abstract
Conductive silver paste, as the key component for various electronic devices, consists of silver filler, binder, solvent and additive. The rising demand of flexible electronics stimulates the development of low-temperature curing pastes. However, creating a fully conductive channel between the silver powders is very challenging due to its poor dispersion and weak interconnection properties. The trade-off between high electrical conductivity and low sintering temperature is major issue to be resolved. To achieve the low temperature sintering between silver particles, partly replacement of silver with Ag2O may become an implementable solution as the self-reduction of Ag2O can yield silver nanoparticle and hence connect the conductive silver pathway. Herein, a novel cocklebur Ag2O is prepared and applied to the silver pastes. The unique morphology of the Ag2O is characterized as the aggregate of nano-particles (10–30 nm) and presence of small bulges on the surface, which can aid to obtain the low temperature reduction of Ag2O and hence improve the interconnection with silver. The influences of the synthetic temperature, molar ratio of reactants and surfactant on the morphology have been investigated in details. And thermal analysis indicates that the Ag2O particles can be self-reduced under a low temperature of approximately 160 °C. Scanning electron microscope images show an interconnected and fully cured morphology of the paste film with the synthesized Ag2O particles. Moreover, as the cocklebur Ag2O based paste has been applied to flexible electrode, outstanding properties of great adhesion, hardness, and bending durability could be observed, indicating its promising potential in the field of flexible electronics.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 27, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-11260-6