We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array.
- Authors
Lee, Juhee; Kim, Yang Woo; Jeon, Sanggeun; Kim, Moonil
- Abstract
The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.
- Subjects
INSERTION loss (Telecommunication); BROADBAND antennas; INTEGRATED circuits; PACKAGING; TERAHERTZ materials; WAVEGUIDES
- Publication
Electronics (2079-9292), 2022, Vol 11, Issue 13, pN.PAG
- ISSN
2079-9292
- Publication type
Article
- DOI
10.3390/electronics11132091