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- Title
Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties.
- Authors
Fan, Sheng-nan; Yuan, Li-li; Wang, Li-zhe; Jia, Bin; Ma, Jia-xin; Yang, Hai-xia; Yang, Shi-yong
- Abstract
Low-temperature curable negative-tone photosensitive polyimide (n-LTPI) viscous solutions were prepared by dissolving photo-crosslinkable poly (amic ester) (pc-PAE) resin, photophotocrosslinker, photoinitiator, and the heteroaromatic base as curing catalysts, and other additives in organic solvents. Among them, the pc-PAE resin was synthesized by polycondensation of aromatic diacid chloride and diester of 2-ethoxymathacrylate, aromatic diamines in aprotic solvents. After being spun-coated on a silicon wafer surface, soft-baked, exposed to UV light, and developed, the n-LTPI with 2% of imidazole (IMZ) as a curing catalyst produced high-quality photo-patterns with line via resolution of 5 μm at 5 μm film thickness. The photo-patterned polymer films thermally cured at 230 °C/2 h in nitrogen showed 100% of the imidization degree (ID) determined by in situ FT-IR spectroscopy. The thermally cured polymer films exhibited great combined mechanical and thermal properties, including mechanical properties with tensile strength of as high as 189.0 MPa, tensile modulus of 3.7 GP, and elongation at breakage of 59.2%, as well as glass transition temperature of 282.0 °C, showing great potential in advanced microelectronic packaging applications.
- Subjects
ORGANIC solvents; MICROELECTRONIC packaging; POLYIMIDES; SILICON surfaces; GLASS transition temperature; POLYMER films; APROTIC solvents
- Publication
Polymers (20734360), 2023, Vol 15, Issue 4, p973
- ISSN
2073-4360
- Publication type
Article
- DOI
10.3390/polym15040973