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- Title
Effect of nano-TiO addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish.
- Authors
Leong, J. C.; Tsao, L. C.; Fang, C. J.; Chu, C. P.
- Abstract
The effects of nano-TiO particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investigated. Metallography reveals that addition of nano-TiO particle retarded wicker-CuSn IMC formed in the Sn3.5Ag0.5Cu composite solder joints. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with increased additions of nano-TiO particles (0.25-1.0 wt%), but further additions up to 1.25 wt% decreased the beneficial influence. This indicates that the presence of a small amount of nano-TiO particles is effective in suppressing the growth of the intermetallic compounds layer. In addition, the shear strength of the soldered joints was improved by larger nano-TiO particle additions, with the peak shear strength occurring at 1.0 wt% of nano-TiO particles into the Sn3.5Ag0.5Cu solder. The fracture mode also changed with increased amounts of nano-TiO particles.
- Subjects
MICROSTRUCTURE; METALLOGRAPHY; INTERMETALLIC compounds; MECHANICAL behavior of materials; MATERIALS science
- Publication
Journal of Materials Science: Materials in Electronics, 2011, Vol 22, Issue 9, p1443
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-011-0327-8