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- Title
The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating.
- Authors
Kejun Zeng; Stierman, Roger; Abbott, Don; Murtuza, Masood
- Abstract
This paper reports on a study of the reaction of solder with the electroless-nickel with immersion gold (ENIG) platting system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIG-plated pad with and without soldering. High-speed pull testing of solder joints was performed expose the pad surface. Results of scanning-electron microscopy/ energy-dispersive x-ray analysis of the cross sections and fractured pad surfaces support the suggestion that black pad is the result of galvanic hyper-corrosion of the planted electroless nickel by the gold plating bath. Criteria are proposed for diagnosting black pad of ENIG plating.
- Subjects
SOLDER &; soldering; PLATING; FILLER metal; MICROSTRUCTURE; SCANNING electron microscopy; ELECTRON microscopy
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2006, Vol 58, Issue 6, p75
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-006-0187-5