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- Title
Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.
- Authors
Wang, Fengyi; Wang, Xinjie; Xu, Kexin; Wang, Jintao; Zhang, Weiwei; Hang, Chunjin; Chen, Hongtao; Li, Mingyu
- Abstract
We proposed Zn@Sn particles to improve the mechanical properties of the Sn–58 wt% Bi (Sn58Bi) solder. The effects of 3, 6, and 9 wt% Zn@Sn particles on the microstructure and mechanical properties of Sn58Bi were investigated. The addition of Zn@Sn to Sn58Bi solder inhibited microstructural coarsening, which mitigated the brittleness of Sn58Bi solder joints during aging. The zinc-rich phases dispersively distributed in the solder joints effectively inhibited the coarsening of the Bi-riched phase. At the same time, Cu5Zn8 instead of Cu6Sn5 formed at the composite solder/Cu interface. After 21 days of aging, the shear strengths of solder joints doped with 6 wt% Zn@Sn decreased from 54.06 to 36.41 MPa. Compared with the undoped solder joints before and after aging, the shear strengths increased by 34% and 173.1%, respectively. Thus, the composite solder paste has great potential to be used as a low-temperature lead-free solder in the electronic packaging industry.
- Subjects
SOLDER joints; COPPER-tin alloys; LEAD-free solder; SOLDER pastes; TIN alloys; ELECTRONIC packaging; SHEAR strength
- Publication
Journal of Materials Science: Materials in Electronics, 2022, Vol 33, Issue 22, p17745
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-022-08637-4