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- Title
Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application.
- Authors
Tu Anh Tran; Mathew, Varughese; Downey, Harold
- Abstract
New automotive specifications derived from higher module integration and more stringent environmental requirements expect plastic packages to operate at higher junction temperatures with prolonged duration. Temperature is a key accelerating factor for failures in electronic package devices because of the thermomechanical, metallurgical and chemical properties of the materials used in the package. Failures in conventional plastic package at high temperatures such as 175 ° C often originate from aluminum-gold wirebonding system because of the formation of Au-Al intermetallic phases and associated Kirkendall voiding which degrades the interface. Methods to overcome such reliability issues in wire bonded devices are to change either the wire material or the bond pad metallurgy or pad finishing other than aluminum which can reliably withstand operations at higher temperature and longer duration.
- Subjects
WIRE bonding (Electronic packaging); ALUMINUM wire; COPPER wire; GOLD wire; AUTOMOBILE reliability
- Publication
Journal of Microelectronic & Electronic Packaging, 2012, Vol 9, Issue 2, p65
- ISSN
1551-4897
- Publication type
Article
- DOI
10.4071/imaps.325