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- Title
THEORETICAL CALCULATION AND SIMULATION OF SURFACE-MODIFIED SCALABLE SILICON HEAT SINK FOR ELECTRONICS COOLING.
- Authors
Yichi ZHANG; Shinichi SAITO; Yoshishige TSUCHIYA; Yeliang WANG
- Abstract
A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estimation of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resistance of 6.84 °C per Watt is achieved for the structure with a larger fin area (13.1 cm²) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.
- Subjects
HEAT sinks (Electronics); HEAT sinks; THERMAL resistance; FINITE element method; HEAT transfer fluids; AIR flow
- Publication
Thermal Science, 2021, Vol 25, Issue 6A, p4181
- ISSN
0354-9836
- Publication type
Article
- DOI
10.2298/TSCI2106181Z