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- Title
Infrared focal plane array storage life assessment by accelerated aging.
- Authors
Asatourian, Rolin
- Abstract
To satisfy the need for characterizing the aging process of infrared focal plane arrays (FPAs) in storage, tests were performed where FPAs were subjected to four different stress temperatures. A Weibull distribution which was fitted to the pixel failure data indicated a shape parameter of 0.97. An Arrhenius analysis showed that an activation energy of 0.76 eV is driving the aging process. Once such a device-specific degradation was characterized, a lifetime was projected for the FPA. Secondly, it was determined that under certain conditions the FPA was expected to outlive the package it was in. The model developed offered a trade-off tool to pass this ‘excess’ reliability of the FPA to a more life-limiting component, namely the package, thus increasing the overall product reliability of the FPA–package combination. Thirdly, a relationship between reliability and cost was established which allowed grading the price of individual units based on their expected field reliability, before they leave the factory. Copyright © 1998 John Wiley & Sons, Ltd.
- Subjects
INFRARED radiation; FOCAL planes; MERCURY cadmium tellurides; INTEGRATED circuits; RELIABILITY in engineering
- Publication
Quality & Reliability Engineering International, 1998, Vol 14, Issue 6, p425
- ISSN
0748-8017
- Publication type
Article
- DOI
10.1002/(SICI)1099-1638(199811/12)14:6<425::AID-QRE226>3.0.CO;2-J