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- Title
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
- Authors
Lee, Jing Rou; Abdul Aziz, Mohd Sharizal; Khor, Chu Yee; Ishak, Mohammad Hafifi Hafiz; Kamarudin, Roslan; Ani, F. Che
- Abstract
This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study the effect of different Cu pillar bump diameters on thermal and mechanical performance during the reflow soldering process. The desktop reflow oven is modeled in ANSYS FLUENT, while the ball grid array (BGA) package assembly is modeled in ANSYS STATIC STRUCTURAL. The accuracy of the simulated reflow temperature profile has been verified by comparing it with the experimental temperature data, according to JEDEC standards. The temperature distributions of solder and Cu pillar bumps are compared. A parametric study has been conducted to analyze the effect of different Cu pillar diameters on the reflow soldering process. By coupling the thermal loads with the structural analysis using thermal FSI, Cu pillar bumps with a diameter of 0.20 mm are found to exhibit the lowest reflow temperature, minimum temperature difference, and minimum deformation and thermal stress, making them the most suitable interconnection joints for flip chip technology. The study also examines the effect of soldering materials on the Cu pillar bump. The findings of this research provide valuable insights into the effects of varying Cu pillar diameters on the reflow soldering process, which can help in the development of more reliable electronic assemblies.
- Subjects
FLIP chip technology; SOLDER &; soldering; FLUID-structure interaction; COLUMNS; COPPER; STRAINS &; stresses (Mechanics); THERMAL stresses
- Publication
Journal of Electronic Materials, 2024, Vol 53, Issue 3, p1201
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-023-10855-3