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- Title
Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD.
- Authors
Leu, Jihperng; Chang, Chin-Cheng; Chen, Alexander; Lin, Mao-Hsing; Huang, Kun-Feng
- Abstract
- Mura defects become visible in a 13.3-in. TFT-LCD using chip-on-glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non-uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC-driver Si chips. In this paper, a 3-D finite-element-analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper-glass-plate post-COG-package processing for identifying the root causes of the light-leakage phenomenon. Prior to that, the simulated warpage results are validated by surface-contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low-cost solution for eliminating mura defects.
- Subjects
PACKAGING research; THIN film transistors; WARPAGE in electronic circuits; FINITE element method; LIQUID crystal displays
- Publication
Journal of the Society for Information Display, 2012, Vol 20, Issue 1, p28
- ISSN
1071-0922
- Publication type
Other
- DOI
10.1889/JSID20.1.28