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- Title
Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.
- Authors
Zhao, W. T.; Ren, J.; Huang, M. L.
- Abstract
The microstructural evolution and mechanical properties of Sn-52In/Sn-3.0Ag-0.5Cu hybrid solder joints soldered at different reflow temperatures (150°C, 175°C, 200°C) were investigated. The mixed percentage of as-soldered hybrid solder joints increased with increasing reflow temperature. With increasing mixed percentage, finely dispersed Ag2In and Ag3Sn particles led to significant refinement of the size of β-Sn grains, and consequently, the combined effect of fine grain strengthening and second-phase dispersion strengthening improved the shear strength, ductility, and fracture energy of the hybrid solder joints. The fracture site of the hybrid solder joints shifted from the Cu6(Sn, In)5 intermetallic compound (IMC)/solder interface to the mixed zone of the solder, and the fine β-Sn grains attenuated crack propagation, enabling more fracture energy to be absorbed before fracture. The hybrid solder joint with 100% mixed percentage exhibited the highest shear strength of 87.8 MPa, highest displacement of 251 μm, and highest fracture energy of 1.4 J.
- Subjects
SOLDER joints; SOLDER &; soldering; DISPERSION strengthening; SHEAR strength; INTERMETALLIC compounds; COPPER-tin alloys
- Publication
Journal of Electronic Materials, 2024, Vol 53, Issue 10, p6463
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-024-11350-z