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- Title
Effects of Ga addition on microstructure and properties of Sn-0.5Ag-0.7Cu solder.
- Authors
Luo, Dong-xue; Xue, Song-bai; Li, Zai-qian
- Abstract
The effects of rare element Ga on solderability, microstructure, and mechanical properties of Sn-0.5Ag-0.7Cu lead-free solder were investigated. The experimental results show that Ga plays a positive role in improving the wettability and the microstructure of the solder. When the content of Ga is at 0.5 wt%, the grain size of the solder is smaller and the shear force is enhanced greatly. It is also found that the thickness of the IMCs at the solder/Cu interface is reduced with proper addition of Ga. The increase of mechanical properties may be related to the refining of IMCs of the solder due to Ga addition.
- Subjects
TIN alloys; SOLDER &; soldering; GALLIUM; METAL microstructure; WETTING
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 8, p3566
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-2057-1