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- Title
Epoxy/ferrite nanocomposites as microwave absorber materials: effect of multilayered structure.
- Authors
Indrusiak, Tamara; Pereira, Iaci M.; Heitmann, Ana P.; Silva, Jeferson G.; Denadai, Ângelo M. L.; Soares, Bluma G.
- Abstract
In the present work, different ferrite-type nanoparticles (Ni0.5Zn0.5Fe2O4, NiFe2O4 and Fe3O4) were incorporated into an epoxy resin to obtain composites loaded with 20 and 40 wt% of filler. The morphology of these monolayered composites was investigated by small-angle X-ray scattering (SAXS) and transmission electron microscopy (TEM), which allow identifying a fractal structure of the ferrite-based filler with rough surface. The electromagnetic properties of the monolayer composites with 1 mm thickness were evaluated by the transmission line method in X-band (8.2–12.4 GHz), whose better response in terms of reflection loss was obtained for the composite filled with Ni0.5Zn0.5Fe2O4. Epoxy-based composites containing 20 and 40 wt% of Ni0.5Zn0.5Fe2O4 in the form of plaques were arranged in two types of three-layered structures: (i) stacked monolayers and (ii) low dielectric spacer sandwiches between monolayers (air, honeycomb and foam), whose structure sequence was built based on the reflectivity simulation. The best system, designed by mathematical simulation and experimental results, consisted of ER/NiZn(40)–honeycomb–ER/NiZn(20) arrangement, which presented RL of around − 40 dB at a frequency of 8.75 GHz. Broadband with > 90% attenuation (minimum of − 10 dB) with band width of around 1.2 GHz and minimum RL ≈ 20 dB (Eabs ≈ 99%) was achieved for both three-layered structures contain in PU foam or honeycomb as low dielectric spacer. The ferrite-based multilayer structures with only 6 mm of thickness constitute promising absorbing materials for applications in both civil and military fields.
- Subjects
MICROWAVE materials; FERRITES; SMALL-angle X-ray scattering; EPOXY resins; TRANSMISSION electron microscopy; FOAM; ELECTRIC lines
- Publication
Journal of Materials Science: Materials in Electronics, 2020, Vol 31, Issue 16, p13118
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-020-03863-0