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- Title
C-SAM for Non-Destructive Failure Analysis of IC Packages.
- Abstract
Reliability of integrated circuit (IC) packages depends, in many respects, on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. The C-mode scanning acoustic microscope (C-SAM) is an excellent tool for non destructive failure analysis of IC packages. It provides a rapid and comprehensive imaging of critical package defects and identifies the location of these defects in three dimensions within the package. The C-SAM system at the University of Maryland has already been used for reliability testing of hermetic (ceramic) and non hermetic (plastic) IC packages.
- Subjects
INTEGRATED circuits; ACOUSTIC microscopes; ELECTRONIC circuits; FAULT tolerance (Engineering); MICROELECTRONICS; QUALITY control
- Publication
Quality & Reliability Engineering International, 1994, Vol 10, Issue 5, p440
- ISSN
0748-8017
- Publication type
Article