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- Title
Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.
- Authors
Hou, Lin; Moelans, Nele; Derakhshandeh, Jaber; De Wolf, Ingrid; Beyne, Eric
- Abstract
This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn3 phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu6Sn5 phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the interface mobility for the IMC/Sn interface, while a uniform IMC morphology is obtained when the Sn grain boundary and IMC/Sn interface mobilities are comparable. For the wavy IMC morphology, a clear effect of the Sn grain size is observed, while for uniform IMC growth, the effect of the Sn grain size is negligible.
- Subjects
CRYSTAL grain boundaries; SOLID state chemistry; CARBON monoxide; CRYSTAL morphology; SOLDER joints; MICROSTRUCTURE; SOLUBILITY
- Publication
Scientific Reports, 2019, Vol 9, Issue 1, pN.PAG
- ISSN
2045-2322
- Publication type
Article
- DOI
10.1038/s41598-019-51179-9