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- Title
Brief Review of Nanosilver Sintering: Manufacturing and Reliability.
- Authors
Wang, Jintao; Chen, Si; Zhang, Luobin; Zhao, Xueting; Duan, Fangcheng; Chen, Hongtao
- Abstract
In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed.
- Subjects
WIDE gap semiconductors; SINTERING; SEMICONDUCTOR materials; SEMICONDUCTOR devices
- Publication
Journal of Electronic Materials, 2021, Vol 50, Issue 10, p5483
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-021-09078-1