We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
A pilot study of half-value layer measurements using a semiconductor dosimeter for intraoral radiography.
- Authors
Shun Nouchi; Hidenori Yoshida; Yusaku Miki; Yasuhito Tezuka; Ruri Ogawa; Ichiro Ogura
- Abstract
Purpose: This pilot study was conducted to evaluate half-value layer (HVL) measurements obtained using a semiconductor dosimeter for intraoral radiography. Materials and Methods: This study included 8 aluminum plates, 4 of which were low-purity (less than 99.9%) and 4 high-purity (greater than 99.9%). Intraoral radiography was performed using an intraoral X-ray unit in accordance with the dental protocol at the authors’ affiliated hospital: tube voltage, 60 kVp and 70 kVp; tube current, 7 mA; and exposure time, 0.10 s. The accuracy of HVL measurements for intraoral radiography was assessed using a semiconductor dosimeter. A simple regression analysis was performed to compare the aluminum plate thickness and HVL in relation to the tube voltage (60 kVp and 70 kVp) and aluminum purity (low and high). Results: For the low-purity aluminum plates, the HVL at 60 kVp (Y) and 70 kVp (Y) was significantly correlated with the thickness of the aluminum plate (X), with Y=1.708+0.415X (r=0.999, P<0.05) and Y=1.980+0.484X (r=0.999, P<0.05), respectively. Similarly, for the high-purity aluminum plates, the HVL at 60 kVp (Y) and 70 kVp (Y) was significantly correlated with the plate thickness(X), with Y=1.696+0.454X (r=0.999, P<0.05) and Y=1.968+0.515X (r=0.998, P<0.05), respectively. Conclusion: This pilot study examined the relationship between aluminum plate thickness and HVL measurements using a semiconductor dosimeter for intraoral radiography. Semiconductor dosimeters may prove useful in HVL measurement for purposes such as quality assurance in dental X-ray imaging.
- Subjects
DOSIMETERS; RADIOGRAPHY; ALUMINUM plates; X-ray imaging; SEMICONDUCTORS
- Publication
Imaging Science in Dentistry, 2023, Vol 53, Issue 3, p217
- ISSN
2233-7822
- Publication type
Article
- DOI
10.5624/isd.20230039