We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics.
- Authors
Stiubianu, George-Theodor; Bele, Adrian; Grigoras, Marian; Tugui, Codrin; Ciubotaru, Bianca-Iulia; Zaltariov, Mirela-Fernanda; Borza, Firuța; Bujoreanu, Leandru-Gheorghe; Cazacu, Maria
- Abstract
Hexagonal boron nitride (hBN) has been incorporated, as an active filler, in a customized silicone matrix to obtain high thermal conductivity composites, maintaining high flexibility and low dielectric permittivity, which are of interest for heat dissipation in energy storage systems (e.g., batteries or supercapacitors) and electronics. By the proper processing of the filler (i.e., hydrophobization with octamethylcyclotetrasiloxane and ultrasonic exfoliation) and its optimal loading (i.e., 10 wt%), composites with thermal conductivity up to 3.543 W·m−1·K−1 were obtained. Conductive heat flow (−280.04 W), measured in real heating–cooling conditions, proved to be superior to that of a commercial heatsink paste (−161.92 W), which has a much higher density (2.5 g/cm3 compared to 1.05 g/cm3 of these composites). The mechanical and electrical properties are also affected in a favorable way (increased modulus and elongation, low dielectric losses, and electrical conductivity) for applications as thermal management materials.
- Subjects
FLEXIBLE electronics; DIELECTRIC loss; ENERGY storage; ENERGY dissipation; THERMAL management (Electronic packaging); THERMAL conductivity; ELECTRIC conductivity; BORON nitride
- Publication
Batteries, 2022, Vol 8, Issue 8, pN.PAG
- ISSN
2313-0105
- Publication type
Article
- DOI
10.3390/batteries8080095