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- Title
High-temperature lead-free solders: Properties and possibilities.
- Authors
Suganuma, Katsuaki; Seong-Jun Kim; Keun-Soo Kim
- Abstract
The article reports on the high-temperature lead-free solders. It states that several candidate alloys have been proposed as alternative solders to high temperature high-lead solders and none of them can fulfill all the requirements to replace the current high-lead solders. The author mentions the three major candidate alloys that can be considered as high-temperature solders: Zn-Sn, Au-Sn, and bismuth-based alloys.
- Subjects
SEALING (Technology); WELDING; TECHNICAL specifications; SOLDER &; soldering; FILLER metal; METALWORK
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2009, Vol 61, Issue 1, p64
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-009-0013-y