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- Title
Design, fabrication, and thermal performance evaluation of cold plates for high-performance computing.
- Authors
Badhe, Parikshit; Kale, Hrithik; Darve, Rohan; Aishwarya, K P; Gadde, Janardhan R; Joseph, Shany; Krishnan, Shankar; Atrey, M D
- Abstract
This paper reports experimental investigations on cold plates made from Low-Temperature Co-fired Ceramic (LTCC) technology for liquid cooling of supercomputer microprocessors. LTCC, a ceramic substrate-based technology with lightweight and ease of fabrication for miniaturization of cooling devices, can be a potential alternative to the existing copper cold plates for future three-dimensional stacked chip architectures. LTCC cold plates were fabricated using ceramic substrates whose thermal conductivity was enhanced using thermal vias. They were embedded with microchannels for liquid with different flow configurations. Their thermal performance is compared against copper cold plates. Deionized (DI) water is used as a coolant. Pressure drop and thermal resistance across different cold plates are measured as per water-cooled data center standards (W3 and W4 class). Obtained experimental results show that the tested LTCC cold plates can be used to cool supercomputer processors. It is concluded that LTCC cold plates can be a potential alternative for existing copper cold plates.
- Subjects
COPPER plating; CERAMICS; HEAT convection; THERMAL resistance; PRESSURE drop (Fluid dynamics); SUPERCOMPUTERS; THERMAL conductivity
- Publication
Sādhanā: Academy Proceedings in Engineering Sciences, 2024, Vol 49, Issue 2, p1
- ISSN
0256-2499
- Publication type
Article
- DOI
10.1007/s12046-024-02434-x