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- Title
Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates.
- Authors
Wang, Jue; Chen, Wenjing; Liu, Dingjun; Li, Chao; Zhou, Jiatao; Zhang, Zezong; Chen, Bin; Jiang, Xiongxin; Hu, Xiaowu
- Abstract
This paper aims to study the effect of soldering time and ultrasonic-assisted time to microstructures, chemical compositions and thickness of intermetallic compounds (IMCs) of three types solder joints after soldering at 290 °C. The Sn3.0Ag0.5Cu (SAC305) solder and three types substrate (pure Cu, Cu–50Co and Cu–50Fe) were selected. The results showed that the compounds formed at the SAC305/Cu solder joint were Cu3Sn and spherical Cu6Sn5, the stick-like (Co,Cu)Sn3 and finely needle-like (Cu,Co)6Sn5 were generated in SAC305/Cu–50Co, while the prismatic (Cu,Fe)6Sn5 and finely granular FeSn2 were produced in SAC305/Cu–50Fe. With the soldering time increased, the IMC overall thickness of all three types solder joints gradually increased. While ultrasound was used, the morphology of Cu6Sn5, (Co,Cu)Sn3 and (Cu,Fe)6Sn5 transformed into prismatic shapes, blocky and slender stick due to cavitation and acoustic flow effects. Moreover, with the application of ultrasound, the IMC thickness of SAC305/Cu and SAC305/Cu–50Co solder joints decreased first then started to up, while that of SAC305/Cu–50Fe solder joints decreased and then remained unchanged.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 20, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-10959-w