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- Title
SAC/Cu 及 SAC-Bi-Ni/Cu 回流焊界面金属间化合物演变.
- Authors
刘洋; 张洪林; 夏鹏; 郭龙军; 孔祥瑞; 王思雨
- Abstract
In order to investigate the evolution of intermetallic compounds (IMC) in micro solder joints. this study focused on the IMC evolution in Sn-Ag-Cu (SAC) and Sn-Ag-Cu-Bi-Ni (SAC-Bi Ni) solder joints under different soldering process during reflow. The effect of soldering process parameters, including soldering temperature, reflow time,and cooling condition, on the morphology and IMC grain size was investigated systemically by deepetching method and Electron Microscope (SEM) observation. Experimental results indicated that soldering temperature had remarkable influence on the morphology of IMCs which may lead to different IMC growth behaviors. IMCs formed at higher soldering temperature showed facet-like appearance. The grain size of IMCs increased quickly when the bulk solder was in molten state. Cooling rate had limited effect on the IMCs but significant influence on the microstructure of the bulk solder.
- Publication
Journal of Harbin University of Science & Technology, 2015, Vol 20, Issue 5, p65
- ISSN
1007-2683
- Publication type
Article
- DOI
10.15938/j.jhust.2015.05.013