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- Title
Mapping of Residual Stress Field Based on Residual-Stress-Free State by ESPI Analysis.
- Authors
Dong Won Kim; Dongil Kwon
- Abstract
We study the residual stress mapping of indented Cu by ESPI (electronic speckle pattern interferometry). Based on the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI), we modeled the relaxed stress in annealing, the thermal strdin/stress and the residual stress field in case of both single and film/substrate systems by using the thermo-elastic theory and the relationship between relaxed stresses and displacements. Thus we mapped the surface residual stress fields on the indented bulk Cu and the 0.5⊔ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -800 MPa to 700 MPa and -600 MPa to 600 MPa respectively around the indented point.
- Subjects
COPPER; RESIDUAL stresses; INTERFEROMETRY; ANNEALING of metals
- Publication
International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2003, Vol 17, Issue 8/9, p1534
- ISSN
0217-9792
- Publication type
Article
- DOI
10.1142/S0217979203019289