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- Title
Peer-Reviewed Literature of Interest to Failure Analysis: Novel Materials, Packages, Components, and 3-D Integration.
- Authors
Bruce, Michael R.
- Abstract
The article presents the list of various peer-reviewed articles published in the issue of "Electronic Device Failure Analysis" journal since 2014. These include the "Tutorial: Defects in Semiconductors--Combining Experiment and Theory" by A. Alkauskas and colleagues, "Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip" by D. Biswas and colleagues, and the "Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration" by K.W. Lee and colleagues.
- Subjects
ELECTRONIC equipment; FAILURE analysis; SEMICONDUCTOR research; COPPER; INTEGRATED circuits
- Publication
Electronic Device Failure Analysis, 2016, Vol 18, Issue 4, p58
- ISSN
1537-0755
- Publication type
Article