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- Title
IMAGING OF PACKAGING-RELATED PROBLEMS IN ELECTRONIC COMPONENTS BY SCANNING ACOUSTIC MICROSCOPY.
- Authors
Wilson, K. J.; Sutherland, R. R.; Videlo, I. D. E.; Wakefield, H.
- Abstract
Low-frequency (50 MHz) scanning acoustic microscopy has been applied to the problem of imaging defects in semiconductor packages. The results have been compared with the more established technique of X-ray shadow imaging. The scanning acoustic microscope has been found to be able to image a greater variety of defects than X-ray shadow imaging, although the acoustic image could often only be fully interpreted after comparison with the corresponding X-ray image. Scanning acoustic microscopy is now proving to be a valuable analysis technique for the detection and characterisation of packaging related problems.
- Subjects
ACOUSTIC microscopy; MICROSCOPY; X-ray microscopes; IMAGING systems; TECHNOLOGY; ELECTRONICS
- Publication
Quality & Reliability Engineering International, 1989, Vol 5, Issue 4, p299
- ISSN
0748-8017
- Publication type
Article
- DOI
10.1002/qre.4680050409