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- Title
Investigation of packaging adhesive properties by molecular dynamics and experiments.
- Authors
Cao, Kaicong; Zhou, Wu; Chen, Lili; He, Jiangbo; Zhan, Li; Chen, Qing; Yu, Huijun; He, Xiaoping
- Abstract
Adhesive polymer is a common and important material used for packaging of microelectronics and microsystem by attaching dies onto packaging shell, and its mechanical property plays a vital role in isolating dies from the thermal stress of substrate. Therefore, it is extremely significant to evaluate the polymer property in a specific packaging process. The molecular dynamics (MD) simulation is conducted in this article to investigate the material properties of the cross‐linked epoxy resin formed by epoxy resin component diglycidyl ether bisphenol A (DGEBA) and curing agent 1,6‐Diaminohexane. The polymer network with conversion up to 87.5% is successfully generated and simulated by constant pressure‐constant temperature ensemble (NPT) and canonical ensemble (NVT) at different temperatures of curing process. Glass transition temperature (Tg) and Young's modulus are extracted and the predicted material properties are in great agreement with the experimental data. The conclusion provides a guideline to design the special curing process for different adhesive requirements.
- Subjects
MOLECULAR dynamics; EPOXY resins; GLASS transition temperature; MECHANICAL properties of condensed matter; MICROELECTRONIC packaging; DENTAL adhesives
- Publication
Journal of Applied Polymer Science, 2021, Vol 138, Issue 1, p1
- ISSN
0021-8995
- Publication type
Article
- DOI
10.1002/app.49613