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- Title
A Batch Sequencing Model for a Semiconductor Packaging Company.
- Authors
Delgado-Arana, Eddy M.; Burtseva, Larysa; Flores-Rios, Brenda; Ibarra, Roberto; Werner, Frank
- Abstract
The objective of this work is to reduce the machine downtime due to setup times during the electrical test in a semiconductor packaging company, whose products has high volume-high mixture characteristics. The group technology is adapted for the plant production workflow modeling. Based on the real data of the production floor, a taxonomy of setup times was developed. The compatibility of different package geometries was validated to build product families. As a result, a flexible batch sequencing model is obtained. The model is implemented in the plant showing an increment of 25.93% of the installed capacity in a pilot test and of 12% under real conditions. The proposed batch sequencing model is exportable to any discrete manufacturing business, which has to sequence production orders.
- Subjects
SEMICONDUCTOR industry; SYSTEM downtime; PACKAGING design; ELECTRICAL test equipment; MANUFACTURING industries; MATHEMATICAL models
- Publication
Engineering Letters, 2017, Vol 25, Issue 2, p102
- ISSN
1816-093X
- Publication type
Article