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- Title
Effect of Zn concentration on the interfacial reactions between Sn-3.0Ag-0.5Cu solder and electroplated Cu- xZn wetting layers ( x = 0-43 wt%).
- Authors
Park, Jae-Yong; Kim, Young; Kim, Young-Ho
- Abstract
Cu- xZn wetting layers ( x = 0, 20, 30, and 43 wt%) were electroplated in a non-cyanide solution and the interfacial reaction with Sn-3.0Ag-0.5Cu (SAC) solder was investigated after reflow and isothermal aging. After reflow, a CuSn intermetallic compound (IMC) formed at the SAC/Cu interface and a small amount of Zn atoms dissolved into the CuSn at the SAC/Cu-Zn interface. After aging, CuSn and microvoids were observed between the CuSn and Cu layer, whereas such voids were not formed at the SAC/Cu-Zn interface. A dominant reaction product during aging was Cu(Sn, Zn) in the Cu-20Zn and Cu-30Zn samples, which was changed from Cu(Sn, Zn) to Cu(Zn, Sn) in the Cu-43Zn sample. In addition, a thin CuZn IMC was observed beneath the Cu(Zn, Sn) in both the SAC/Cu-30Zn and SAC/Cu-43Zn joints after aging for a long time. X-ray diffraction showed that α-CuZn and β-CuZn peaks were obtained from the Cu-30Zn and Cu-43Zn wetting layers. The crystal structure of Cu(Zn, Sn) and/or CuZn IMCs was a β′-CuZn (ordered phase) with a superlattice peak. As the Zn concentration in the Cu- xZn wetting layers increased to 30 wt%, the IMCs growth rate was gradually reduced, but was increased in the Cu-43Zn sample. The excessive IMC growth of the Cu-43Zn sample was attributed to the fast growth of Cu(Zn, Sn) IMC.
- Subjects
INTERFACIAL reactions; WETTING agents; SOLDER &; soldering; X-ray diffraction; CYANIDES
- Publication
Journal of Materials Science: Materials in Electronics, 2016, Vol 27, Issue 6, p5916
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-016-4510-9