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- Title
Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnects.
- Authors
Lu, Henry Y.; Balkan, Haluk; Ng, K. Y. Simon
- Abstract
The impact of copper content on the Sn-Ag-y%Cu (Ag = constant = 3.5; y = 0.0, 0.5, 1.0, and 2.0) interconnects was investigated in this study. The copper content and solid-liquid (S-L) reactions were used as inputs, and the outputs were the interfacial microstructure evolution and joint macro-performance. Surface microetching microscopy, cross-section microscopy, energy-dispersive x-ray analysis, shear test, and differential scanning calorimetry were used in the studies. It was discovered that as-soldered Sn-Ag-y%Cu interconnects could have different interfacial microstructures depending on copper content; no Ag3Sn plates were observed for any alloy groups. After the S-L reactions, Ag3Sn plates occurred for all groups. The magnitude of the Ag3Sn plate growth depended on copper content. This and other effects of copper content on Sn-Ag-Cu interconnects are discussed in this article.
- Subjects
SOLID-liquid interfaces; COPPER; ALLOYS; MICROSTRUCTURE; MICROSCOPY
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2005, Vol 57, Issue 6, p30
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-005-0133-y