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- Title
Improving the thermal conductivity of PMIA/EP composites by the synergistic effect of modified boron nitride and graphene oxide.
- Authors
Yue, Mengjie; Pu, Zejun; Wu, Fang; Zhu, Rongli; Wang, Xu; Yu, Dayang; Zhong, Jiachun
- Abstract
In this study, h-BN-OH was obtained by hydroxylating h-BN and subsequently KH560 was grafted onto the surface of h-BN-OH, resulting in h-BN-KH560. The h-BN-KH560 was then dispersed in an epoxy resin (EP) to create an EP/h-BN-KH560 adhesive solution, with the content of h-BN-KH560 being varied. Graphene oxide (GO) was dispersed in PMIA precipitated fibers to produce PMIA/GO composite paper. Finally, the surface of the composite paper was evenly coated with the EP/h-BN-KH560 adhesive solution, and then PMIA/EP/GO/h-BN composites with different h-BN-KH560 contents and good thermal conductivity were prepared by hot pressing. The FTIR analysis confirmed the successful grafting of KH560 onto the surface of h-BN-OH. By utilizing h-BN-KH560 and GO as thermal conductive fillers, we achieved a higher thermal conductivity in the composite material, creating a "dual thermal conductivity network" compared to using a single filler. Additionally, the thermal conductivity increased as the content of h-BN-KH560 increased. At h-BN-KH560 contents of 20 wt%, 40 wt%, and 60 wt%, the thermal conductivities of the prepared PMIA/EP/GO/h-BN composites were 0.661 Wm−1K−1, 1.082 Wm−1K−1, and 1.206 Wm−1K−1, respectively. Importantly, the addition of the thermal conductive filler did not significantly affect the thermal stability of the composites.
- Subjects
THERMAL conductivity; GRAPHENE oxide; BORON nitride; EPOXY resins; COMPOSITE materials; THERMAL stability
- Publication
Journal of Polymer Research, 2024, Vol 31, Issue 2, p1
- ISSN
1022-9760
- Publication type
Article
- DOI
10.1007/s10965-024-03874-z